The H2 Hydrogen Furnace is a high-performance thermal processing equipment designed for material treatment under hydrogen (H2) atmosphere, available in atmospheric, vacuum, positive-pressure, or negative-pressure configurations. It integrates advanced heating technology, precise temperature control, and reliable gas management systems to create a stable, oxygen-free environment. Widely used in metallurgy, electronics, powder metallurgy, ceramics, and semiconductor industries, this furnace ensures material purity, improves processing efficiency, and optimizes product performance during annealing, sintering, reduction, and brazing processes.
Features :
l Stable Atmosphere Control: Equipped with high-precision flow meters and pressure regulators, ensuring uniform H2 distribution and adjustable gas concentration (0-100% H2) to meet diverse process requirements.
l Precise Temperature Management: Adopts resistance/induction/infrared heating technology with PID temperature control, offering temperature accuracy of ±1℃ and uniform temperature field (temperature difference ≤±5℃ in working zone).
l Safe Operation Design: Integrated with H2 leak detection sensors, automatic gas cut-off valves, and over-temperature/over-pressure protection systems to eliminate potential safety hazards.
l Durable & Efficient Structure: High-temperature resistant ceramic fiber insulation and corrosion-resistant inner chamber (stainless steel/quartz) extend service life, while energy-saving heating elements reduce power consumption.
l Flexible Adaptability: Customizable working size, temperature range (room temp-2000℃), and pressure settings to fit laboratory research or industrial mass production needs.
Parameter | Specification |
Temperature Range | Room Temperature - 2000℃ (customizable according to heating type) |
Temperature Accuracy | ±1℃ |
Temperature Uniformity | ≤±5℃ (in effective working zone) |
Working Zone Size | (customizable) |
Atmosphere Type | Pure H2, H2-Ar mixed gas, H2-N2 mixed gas (optional) |
Gas Flow Rate | 0-50L/min (adjustable, with precise flow meter) |
Operating Pressure | -0.1MPa (negative pressure) - 0.5MPa (positive pressure) |
Heating Method | Resistance heating (Ni-Cr, Mo-Si2), induction heating, infrared heating (optional) |
Control System | PLC + touch screen, PID automatic temperature control, program setting (up to 50 segments) |
Protection Functions | ü Over-temperature alarm, ü H2 leak detection, ü Pressure overload protection, ü Power failure memory |
Power Supply | 220V/380V/415V, 50/60Hz (customizable according to regional standards) |
Warranty | One year |
Application :
Metal Processing: Annealing of copper, stainless steel, and alloy materials to eliminate internal stress and improve toughness; reduction of metal oxides (CuO, Fe2O3) to produce high-purity metals.
Powder Metallurgy: Sintering of metal powder parts (e.g., iron-based, copper-based components) to enhance density and mechanical properties without oxidation.
Electronics & Semiconductors: Wafer annealing, semiconductor material processing, and brazing of electronic components to ensure high conductivity and stability.
Ceramics & Advanced Materials: Sintering of alumina, zirconia ceramics, and composite materials to optimize microstructure and reduce porosity.
Laboratory Research: Small-batch sample testing, material performance research, and process optimization in universities, research institutes, and R&D centers.
The H2 Hydrogen Furnace is a high-performance thermal processing equipment designed for material treatment under hydrogen (H2) atmosphere, available in atmospheric, vacuum, positive-pressure, or negative-pressure configurations. It integrates advanced heating technology, precise temperature control, and reliable gas management systems to create a stable, oxygen-free environment. Widely used in metallurgy, electronics, powder metallurgy, ceramics, and semiconductor industries, this furnace ensures material purity, improves processing efficiency, and optimizes product performance during annealing, sintering, reduction, and brazing processes.
Features :
l Stable Atmosphere Control: Equipped with high-precision flow meters and pressure regulators, ensuring uniform H2 distribution and adjustable gas concentration (0-100% H2) to meet diverse process requirements.
l Precise Temperature Management: Adopts resistance/induction/infrared heating technology with PID temperature control, offering temperature accuracy of ±1℃ and uniform temperature field (temperature difference ≤±5℃ in working zone).
l Safe Operation Design: Integrated with H2 leak detection sensors, automatic gas cut-off valves, and over-temperature/over-pressure protection systems to eliminate potential safety hazards.
l Durable & Efficient Structure: High-temperature resistant ceramic fiber insulation and corrosion-resistant inner chamber (stainless steel/quartz) extend service life, while energy-saving heating elements reduce power consumption.
l Flexible Adaptability: Customizable working size, temperature range (room temp-2000℃), and pressure settings to fit laboratory research or industrial mass production needs.
Parameter | Specification |
Temperature Range | Room Temperature - 2000℃ (customizable according to heating type) |
Temperature Accuracy | ±1℃ |
Temperature Uniformity | ≤±5℃ (in effective working zone) |
Working Zone Size | (customizable) |
Atmosphere Type | Pure H2, H2-Ar mixed gas, H2-N2 mixed gas (optional) |
Gas Flow Rate | 0-50L/min (adjustable, with precise flow meter) |
Operating Pressure | -0.1MPa (negative pressure) - 0.5MPa (positive pressure) |
Heating Method | Resistance heating (Ni-Cr, Mo-Si2), induction heating, infrared heating (optional) |
Control System | PLC + touch screen, PID automatic temperature control, program setting (up to 50 segments) |
Protection Functions | ü Over-temperature alarm, ü H2 leak detection, ü Pressure overload protection, ü Power failure memory |
Power Supply | 220V/380V/415V, 50/60Hz (customizable according to regional standards) |
Warranty | One year |
Application :
Metal Processing: Annealing of copper, stainless steel, and alloy materials to eliminate internal stress and improve toughness; reduction of metal oxides (CuO, Fe2O3) to produce high-purity metals.
Powder Metallurgy: Sintering of metal powder parts (e.g., iron-based, copper-based components) to enhance density and mechanical properties without oxidation.
Electronics & Semiconductors: Wafer annealing, semiconductor material processing, and brazing of electronic components to ensure high conductivity and stability.
Ceramics & Advanced Materials: Sintering of alumina, zirconia ceramics, and composite materials to optimize microstructure and reduce porosity.
Laboratory Research: Small-batch sample testing, material performance research, and process optimization in universities, research institutes, and R&D centers.
