The Rapid Thermal Process Ovens has a heating rate of 200K/sec and is a device that can achieve rapid sample heating and precise temperature control in a very short period of time. This high-speed heating capability gives it significant advantages in fields such as semiconductor manufacturing and material research, greatly reducing process time, minimizing thermal budget, reducing thermal damage to materials, and improving production efficiency and product performance.
Specifications
Type | RTP 100 | RTP 150 |
Max temperature | 1000℃ | 1200℃ |
Vacuum capable | Up to 10-3 hPa | |
Chamber material | Aluminium chamber and quartz glass universal holder | |
Process Chamber | Quartz glass chamber | |
Chamber height | 18mm | |
Vacuum capacity | Up to 10-3hpa,RTP-100-HV up to 10-6hpa | |
Temperature max. | 1200℃ | |
Heating | Top and bottom heating with 18 IR Lamps(20KW) | |
Chamber cooling | Water cooled | |
Substrate Cooling | By nitrogen gas | |
Process chamber | 134*169*18mm(W*D*H) | |
Electric connection | 400/230V,20kw | |
Weight | 55kg | |
Flow controller | Mass flow controller | |
Max Past size | 100mm dia.(4’’) | |
For more information, please contact us.
The Rapid Thermal Process Ovens has a heating rate of 200K/sec and is a device that can achieve rapid sample heating and precise temperature control in a very short period of time. This high-speed heating capability gives it significant advantages in fields such as semiconductor manufacturing and material research, greatly reducing process time, minimizing thermal budget, reducing thermal damage to materials, and improving production efficiency and product performance.
Specifications
Type | RTP 100 | RTP 150 |
Max temperature | 1000℃ | 1200℃ |
Vacuum capable | Up to 10-3 hPa | |
Chamber material | Aluminium chamber and quartz glass universal holder | |
Process Chamber | Quartz glass chamber | |
Chamber height | 18mm | |
Vacuum capacity | Up to 10-3hpa,RTP-100-HV up to 10-6hpa | |
Temperature max. | 1200℃ | |
Heating | Top and bottom heating with 18 IR Lamps(20KW) | |
Chamber cooling | Water cooled | |
Substrate Cooling | By nitrogen gas | |
Process chamber | 134*169*18mm(W*D*H) | |
Electric connection | 400/230V,20kw | |
Weight | 55kg | |
Flow controller | Mass flow controller | |
Max Past size | 100mm dia.(4’’) | |
For more information, please contact us.
